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datasheet product structure : silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays . 1/18 tsz02201-0f1f0a200150-1-2 5.april.2016.rev.003 ? 2016 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com ac/dc drivers pwm type dc/dc converter ic included 650v mosfet bm2p039 general the pwm type dc/dc converter bm2p039 for ac/dc provides an optimum system for all products that include an electrical outlet. bm2p039 supports both isolated and non-isolated devices, enabling simpler design of various types of low-power electrical converters. bm2p039 built in a hv starter circuit that tolerates 650v, it contributes to low-power consumption. with current detection resist ors as external devices, a higher degree of design freedom is achieved. switching frequency adopts fixed system. since current mode control is utiliz ed, current is restricted in each cycle and excellent performance is demonstrated in bandwidth and transient response. the switching frequency is 10 0 khz. at light load, the switching frequency is reduced and high efficiency is achieved. a frequency hopping function is also on chip, which contributes to low emi. basic specifications ? operating power supply voltage range : vcc: 8.9v to 26.0v drain: to 650v ? operating current : normal mode 1.000ma (typ) burst mode 0.400ma (typ) ? oscillation frequency : 100khz (typ) ? operating temperature : -40 o c to +105 o c ? mosfet on resistance : 2.4 ? (typ) features ? pwm frequency : 100khz ? pwm current mode method ? frequency hopping function ? burst operation when load is light ? frequency reduction function ? built-in 650v start circuit ? built-in 650v switching mosfet ? vcc pin under voltage protection ? vcc pin overvoltage protection ? source pin open protection ? source pin short protection ? source pin leading-edge-blanking function ? per-cycle over current protection circuit ? soft start ? secondary over current protection circuit ? br pin ac input low voltage protection package dip7k: 9.20mm6.35mm4.30mm pitch 2.54mm (typ) (typ) (typ) (typ) applications ac adapters, tv and household appliances (vacuum cleaners, humidifiers, air cleaners, air conditioners, ih cooking heaters, rice cookers, etc.) application circuit ac 85 - 265 vac fuse + - filter diode bridge error amp br figure 1. application circuit
2/18 datasheet d a t a s h e e t bm2p039 tsz02201-0f1f0a200150-1-2 5.april.2016.rev.003 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings (ta=25 ? c) parameter symbol rating unit conditions maximum applied voltage 1 vmax1 -0.3 to 30 v vcc maximum applied voltage 2 vmax2 -0.3 to 6.5 v source, fb, br maximum applied voltage 3 vmax3 650 v drain drain current pulse i dp 5.20 a p w =10usec, duty cycle=1% allowable dissipation pd 2.00 w operating temperature r ange topr -40 to +105 o c maximum junction temperature tjmax 150 o c storage temperature range tstr -55 to +150 o c ( note) dip7 : when mounted (on 74.2 mm 74.2 mm,1.6 mm thick, glass epoxy on double-layer substrate). reduce to 16 mw/ ? c when ta = 25 ? c or above. operating conditions (ta=25 ? c) parameter symbol rating unit conditions power supply voltage range 1 v cc 8.9 to 26.0 v vcc pin voltage power supply voltage range 2 v drain to 650 v drain pin voltage electrical characteristics of mosfet part (unless otherwise noted, ta=25 ? c, vcc=15v) parameter symbol specifications unit conditions minimum standard maximum [mosfet block ] between drain and source voltage v (br)dds 650 - - v i d =1ma / v gs =0v drain leak current i dss - - 100 a v ds =650v / v gs =0v on resistance r ds(on) - 2.4 3.6 ? i d =0.25a / v gs =10v avalanche energy e as 400 j design assurance avalanche energy circuit e a s : avalanche energy i a s : avalanche current v ( br ) dss : drain - source breakdown voltage v gs : gate - source voltage v ds : drain - source voltage v dd : power supply voltage l : coil r g : gate resistance
3/18 datasheet d a t a s h e e t bm2p039 tsz02201-0f1f0a200150-1-2 5.april.2016.rev.003 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics (unless otherwise noted, ta=25 ? c, vcc=15v) parameter symbol specifications unit conditions minimum standard maximum [ circuit current ] circuit current (on) 1 i on1 650 1000 1350 a fb=2.0v (at pulse operation) circuit current (on) 2 i on2 - 400 500 a fb=0.0v (at burst operation) [ vcc protection function ] vcc uvlo voltage 1 v uvlo1 12.50 13.50 14.50 v vcc rises vcc uvlo voltage 2 v uvlo2 7.50 8.20 8.90 v vcc falls vcc uvlo hysteresis v uvlo3 - 5.30 - v v uvlo3 = v uvlo1 - v uvlo2 vcc ovp voltage 1 v ovp1 26.0 27.5 29.0 v vcc rises vcc ovp voltage 2 v ovp2 - 23.5 - v vcc falls latch released vcc voltage v latch - v uvlo2 -0.5 - v vcc recharge start voltage v chg1 7.70 8.70 9.70 v vcc recharge stop voltage v chg2 12.00 13.00 14.00 v latch mask time t latch 50 100 150 s thermal shut down temperature tsd 118 145 172 ? c [ pwm type dcdc driver block ] oscillation frequency 1 f sw1 90 100 110 khz fb=2.0v oscillation frequency 2 f sw2 20 25 30 khz fb=0.4v frequency hopping width 1 f del1 - 6.0 - khz fb=2.0v hopping fluctuation frequency f ch 75 125 175 hz minimum pulse width tmin - 650 1000 ns soft start time 1 t ss1 0.30 0.50 0.70 ms soft start time 2 t ss2 0.60 1.00 1.40 ms soft start time 3 t ss3 1.20 2.00 2.80 ms soft start time 4 t ss4 4.80 8.00 11.20 ms maximum duty dmax 68.0 75.0 82.0 % fb pin pull-up resistance r fb 23 30 37 k ? ? fb / ? cs gain gain - 4.00 - v/v fb burst voltage v bst 0.300 0.400 0.500 v fb falls fb voltage of starting frequency reduction mode v dlt 1.100 1.250 1.400 v fb olp voltage 1a v folp1a 2.60 2.80 3.00 v overload is detected (fb rise) fb olp voltage 1b v folp1b - 2.60 - v overload is detected (fb drop) fb olp on timer t folp1 40 64 88 ms fb olp start up timer t folp1 26 32 38 ms fb olp off timer t folp2 358 512 666 ms [ over current detection block ] overcurrent detection voltage v cs 0.380 0.400 0.420 v ton=0us overcurrent detection voltage ss1 v cs_ss1 - 0.100 - v 0 [ms] to t ss1 [ms] overcurrent detection voltage ss2 v cs_ss2 - 0.150 - v t ss1 [ms] to t ss2 [ms] overcurrent detection voltage ss3 v cs_ss3 - 0.200 - v t ss2 [ms] to t ss3 [ms] overcurrent detection voltage ss4 v cs_ss4 - 0.300 - v t ss3 [ms] to t ss4 [ms] leading edge blanking time t leb - 250 - ns over current detection ac voltage compensation factor k cs 12 20 28 mv/ s source pin short protection voltage v cssht 0.020 0.050 0.080 v [ start circuit block ] start current 1 i start1 0.100 0.500 1.000 ma vcc=0v start current 2 i start2 2.600 3.000 6.000 ma vcc=10v off current i start3 - 10 20 ua input current of drain pin, when vcc uvlo released. (mosfet off) start current switching voltage v sc 0.800 1.500 2.100 v [br pin function] br uvlo detection voltage1 v br1 0.45 0.50 0.55 v br rises br uvlo detection voltage 2 v br2 0.29 0.35 0.41 v br falls br uvlo hysteresis v br3 - 0.15 - v v br3 = v br1 - v br2 br uvlo detection delay time1 t br1 50 100 150 s br rises br uvlo detection delay time2 t br2 150 256 350 ms br falls
4/18 datasheet d a t a s h e e t bm2p039 tsz02201-0f1f0a200150-1-2 5.april.2016.rev.003 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 pin descriptions table 1. pin description no. pin name i/o function esd diode vcc gnd 1 source i/o mosfet source pin 2 br i input ac voltage monitor pin - 3 gnd i/o gnd pin - 4 fb i feedback signal input pin - 5 vcc i power supply input pin - 6 drain i/o mosfet drain pin - - 7 drain i/o mosfet drain pin - - i/o equivalent circuit diagram figure 2. i/o equivale nt circuit diagram
5/18 datasheet d a t a s h e e t bm2p039 tsz02201-0f1f0a200150-1-2 5.april.2016.rev.003 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 block diagram figure 3. block diagram
6/18 datasheet d a t a s h e e t bm2p039 tsz02201-0f1f0a200150-1-2 5.april.2016.rev.003 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 description of blocks ( 1 ) start circuit (drian: 6,7pin) this ic built in start circuit (tolerates 650v). it enables to be low standby mode electricity and high speed starting. after starting, consumption power is idling current i start3 (typ=10 a) only. reference values of starting time are shown in figure 6. when cvcc=10 f it can start less than 0.1 sec. figure 4. block diagram of start circuit istart1 istart2 vsc v uvlo 1 10v vcc voltage[v] istart3 0 figure 5. start current vs vcc voltage figure 6. start time (reference value) * start current flows from the drain pin ex) consumption power of start circuit only when the vac=100v pvh 100v* 2*10ua=1.41mw ex) consumption power of start circuit only when the vac=240v pvh 240v* 2*10ua=3.38mw
7/18 datasheet d a t a s h e e t bm2p039 tsz02201-0f1f0a200150-1-2 5.april.2016.rev.003 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 ( 2 ) start sequences (soft start operation, light load operation, and auto recovery operation during overload protection) start sequences are shown in figure 7. see the sections below for detailed descriptions. vout switing vh vcc(1pin) fb(8pin) soft start 64ms iout normal load light load within 32ms vcc=8.2v over load internal ref pull up burst mode ab c d ef gh i switching stop vcc=13.5v fb olp on figure 7. start sequences timing chart a: input voltage vh is applied. b: this ic starts operation when vcc pin voltage rises and vcc > v uvlo1 (typ=13.5v). switching function starts when other prot ection functions are judged as normal. then the vcc pin voltage drop because of consumpti on current of vcc pin. in the case of vcc < v chg1 (typ=8.7v), the vcc recharge circuit operates. c: with the soft start function, over current limit value is restricted to prevent any excessive rise in voltage or current. d: when the switching operation starts, and vout rises. when the output voltage becomes to stable state, vcc vo ltage also becomes to stable state through auxiliary winding. please set the rated voltage within the t folp1b period (32msec typ) from vcc voltage > v uvlo1 . e: during a light load, if it reaches fb voltage < v bst (typ=0.4v), the ic starts burst operation to keep power consumption low. during burst operation, it becomes low-power consumption mode. f: when the fb voltage > v folp1a (typ=2.8v), it becomes a overload operation. g: when fb pin voltage keeps v folp1a (typ=2.8v) at or above t folp (typ=64msec), the overlo ad protection function is triggered and switching stops 64msec later. if the fb pin voltage becomes fb < v folp1b even once, the ic?s fb olp timer is reset. h: if the vcc voltage drops to vcc < v uvlo2 (typ=7.7v) or below, restart is executed. i: the ic?s circuit current is reduced and the vcc pin value rises. (same as b)
8/18 datasheet d a t a s h e e t bm2p039 tsz02201-0f1f0a200150-1-2 5.april.2016.rev.003 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 ( 3 ) vcc pin protection function bm2p039 built in vcc low voltage protec tion function vccuvlo (under voltage lock out), over voltage protection function vcc ovp (over voltage protection) and vcc charge function that operates in case of dropping the vcc voltage. vcc uvlo and vcc ovp monitor vcc pin and prev ent vcc pin from destroying switching mosfet at abnormal voltage. vcc charge function stabilizes the secondary output voltage by charging from the high voltage line by start circuit at dropping the vcc voltage. ( 3-1 ) vcc uvlo vcc ovp function vcc uvlo and vcc ovp are auto recovery protections. a nd they have voltage hysteresis. refer to the operation figure 8. switching is stopped by the vccovp function when vcc pin voltage > v ovp1 (typ=27.5v), and switching is restart when vcc pin voltage < v ovp2 (typ=23.5v) figure 8. vcc uvlo / ovp timing chart a: when voltage is applied to the drain pin, vcc pin voltage starts rising. b: when the vcc pin is more than v uvlo , the vcc uvlo function is released and dc/dc operation starts c: when the vcc pin is less than v chg1 , vcc charge function operates and the vcc voltage rises. d: when the vcc pin is more than v chg2, vcc charge function is stopped. e: the condition the vcc pin is more than v ovp1 continues for t latch (typ=100usec), the sw itching operation is stopped by the vccovp function. f: when the vcc pin less than v ovp2 , the switching operation restarts. g: the high voltage line vh drops. h: same as c. i: same as d. j: when the vcc pin is less than v uvlo2 , the switching operation is stop ped by the vcc uvlo function.
9/18 datasheet d a t a s h e e t bm2p039 tsz02201-0f1f0a200150-1-2 5.april.2016.rev.003 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 ( 3-2 ) vcc charge function if the vcc pin drops to v chc1 after once the vcc pin becomes more than v uvlo1 and the ic starts to operate, the vcc charge function operates. at that time, the vcc pin is charged from drain pin through start circuit. by this operation, bm2p039 doesn?t occur to start failure. when the vcc pin voltage raises to v chg2 or above, charge is stopped. the operations are shown in figure 9. vcc v uvlo1 v uvlo2 v chg1 switching vh charge charge charge output voltage v chg2 charge charge abcdefgh vh figure 9. charge operation vcc pin charge operation a: drain pin voltage raises and the vcc pin star ts to be charged by the vcc charge function. b: when the vcc pin is more than v uvlo1 , the vcc uvlo function releases and vcc charge function stops. then the dc/dc operation starts. c: when dc/dc operation starts, the vcc volt age drops because the output voltage is low. d: when the vcc pin is less than v chg1 , the vcc recharge function operates and vcc pin voltage rises. e: when the vcc pin is more than v chg2 , vcc recharge function stops. f: when the vcc pin is less than v chg1 , vcc recharge function operates and vcc pin voltage rises. g: when the vcc pin is more than v chg2 , vcc recharge function stops. h: after starting of the output volt age finished, vcc is charged by the auxiliary winding and vcc pin stabilizes.
10/18 datasheet d a t a s h e e t bm2p039 tsz02201-0f1f0a200150-1-2 5.april.2016.rev.003 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 ( 4 ) dcdc driver (pwm comparator, frequency hopping, slope compensation, osc, burst) bm2p039 performs current mode pwm control. an internal o scillator sets a fixed switching frequency (100 khz typ). bm2p039 is integrated switching freque ncy hopping function which changes the switching frequency to fluctuate as shown in figure 10 below. the fluctuation cycle is 125 hz typ. 100.0 switching frequency [khz] 106.0 125 hz(8ms) time 94.0 95.5 97.0 98.5 101.5 104.5 103.0 500us figure 10. frequency hopping function max duty cycle is fixed as 75% (typ) and min pulse width is fixed as 650 nsec (typ). with current mode control, when the duty cycle exce eds 50%, sub harmonic oscillation may occur. as a countermeasure to this, bm2p039 is built in slope compensation circuits. bm2p039 is built in burst mode circuit and frequency re duction circuit to achieve lower power consumption. fb pin is pulled up by r fb (30k ? typ).fb pin voltage is changed by secondary output voltage (secondary load power). fb pin is monitored, burst mode op eration and frequency detection start. figure 11 shows the fb voltage, and switching frequency, dcdc operation. ? mode1 : burst operation ? mode2 : frequency reduction operation ? mode3 : fixed frequency operation (operate at the max frequency) ? mode4 : over load operation (detect the ov er load state and stop the pulse operation) x y fb [v] switching frequency [khz] 0.40v 1.25v 25khz 100khz 2.00v mode1 mode2 mode3 2.80v mode4 figure 11. switching operation state changes by fb pin voltage
11/18 datasheet d a t a s h e e t bm2p039 tsz02201-0f1f0a200150-1-2 5.april.2016.rev.003 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 ( 5 ) over current limiter bm2p039 is built in over current limiter per cycle. if t he source pin exceeds a certain voltage, switching is stopped. it is also built in ac voltage compensation function. this is the function which compensates the maximum power as the ac voltage?s change by increasing over current limiter with time. shown in figure 12, 13 and14. figure 12. no ac voltage compensation function figure 13. built-in ac compensation voltage primary peak current is decided as the formula below. primary peak current: i peak = v cs /rs + v dc / lp *t delay v cs : over current limiter voltage internal ic, rs: current detection resistance, v dc : input dc voltage, l p : primary inductance, t delay : delay time after detection of over current limiter figure 14. over current limiter voltage ( 6 ) l.e.b. period when the driver mosfet is turned on, surge current o ccurs at each capacitor component and drive current. therefore, because source pin voltage ri ses temporarily, the detection errors ma y occur in the over current limiter circuit. to prevent this detection errors, drain is switc hed from high to low and the source signal is masked for 250nsec by the on-chip l.e.b. ( leading edge blanking) function.
12/18 datasheet d a t a s h e e t bm2p039 tsz02201-0f1f0a200150-1-2 5.april.2016.rev.003 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 ( 7 ) source pin short protection function when the source pin is shor ted, bm2p039 is over heat. bm2p039 built in short protection function to prevent destroying. ( 8 ) source pin open protection if the source pin becomes o pen, bm2p039 may be damaged. to prevent to be damaged, bm2p039 built in open protection circuit (auto recovery protection). ( 9 ) output over load protection function (fb olp comparator) the output overload protection function monitors the secondar y output load status at the fb pin, and stops switching when an overload occurs. in case of overload, the output voltage is reduced and curr ent no longer flows to the photo coupler, so the fb pin voltage rises. when the status that fb pin voltage is more than v folp1a (typ=2.8v) continues for the period t folp1 (typ=64msec), it is judged as an overload a nd stops switching. when the fb pin > v folp1a (typ=2.8v), if the voltage goes lower than v folp1b (typ=2.6v) during the period t folp1 (typ=64msec), the overload protection timer is reset. the switching operation is performed during this period t folp1 (typ=64msec). at startup, the fb voltage is pulled up to the ic?s in ternal voltage, so operation starts at a voltage of v folp1a (typ=2.8v) or above. therefore, at startup the fb voltage must be set to go to v folp1b (typ=2.6v) or below during the period t folp1 (typ=64msec), and the secondary output voltage?s start time must be set within the period t folp1 (typ=64msec) following startup of the ic. recovery from the once detection of fbolp, after the period t folp2 (typ=512msec). vcc v uvlo 1 v uvlo 2 v chg1 switching fb v folp 1 a 64ms 64ms 512ms vh charge charge charge 512ms v chg 2 a bcde fgh figure 15. over load protection (auto recovery) a: the fbolp comparator detects over load because the fb pin is more than v folp1a . b: if the state of a c ontinues for the period t folp1 (typ=64msec), switching is stopped after t folp1 (typ=64msec) from fb olp detection. c: while switching stops by the over load protection f unction, if the vcc pin voltage drops and vcc pin voltage reaches v chg1 or above, the vcc charge function oper ates so the vcc pin voltage rises. d: vcc charge function stops when the vcc pin voltage becomes more than v chg2 . e: if t folp2 (typ=512msec) go on from b point, the sw itching function starts on soft start. f: if t folp1b (typ=64msec) go on from e point to continues an overload condition (fb > v folp1a ) , the switching function stops. g: while the switching stops, vcc pin voltage drops to v chg1 or below. then the vcc charge function operates and vcc pin voltage rises. h: if the vcc pin voltage becomes over v chg2 by the vcc charge function, the v cc charge function operation stops.
13/18 datasheet d a t a s h e e t bm2p039 tsz02201-0f1f0a200150-1-2 5.april.2016.rev.003 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 ( 10 ) input voltage protection function this ic has br-uvlo function to monitor input voltage. by monitoring input voltage, it can be prevented from breaking of ic. ac voltage and dc voltage can be monitored by br pin. ac 85 - 265 vac fuse + - filter diode bridge error amp br ac 85 - 265 vac fuse + - filter diode bridge error amp br rbr1 rbr2 rbr1 rbr2 figure 16(a). ac voltage monitor setting figure 16(b). dc voltage monitor setting br uvlo function can protect the break ing of ic when input voltage is low. operation mode of protection circuit operation mode of protection f unctions are shown in table 2. table 2. operation mode of protection circuit function operation mode vcc under voltage locked out auto recovery vcc over voltage protection auto recovery tsd latch (with 100usec timer) fb over limited protection auto recovery (with 64msec timer) source open protection auto recovery br uvlo auto recovery (with 256msec timer)
14/18 datasheet d a t a s h e e t bm2p039 tsz02201-0f1f0a200150-1-2 5.april.2016.rev.003 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 sequence the sequence diagram is show in figure 17. in all condition, the operations transit of f mode if the vcc voltage becomes less than 8.2v. soft start1 soft start4 burst mode & low power mode *pulse off normal mode off mode olp mode (pulse stop) latch off mode (pulse stop) soft start2 soft start3 pulse off fbolp off timer (512ms) br uvlo (pulse stop) source open (pulse stop) vcc ovp (pulse stop) figure 17. the sequence diagram thermal loss the thermal design should set operation for the following conditions. (since the temperature shown below is the guaranteed tem perature, be sure to take a margin into account.) 1. the ambient temperature ta must be 105 o c or less. 2. the ic?s loss must be within the allowable dissipation pd. the thermal abatement characteristics are as follows. (pcb: 74.2 mm 74.2mm 1.6 mm, mounted on glass epoxy double-layer substrate.) figure 18. dip7k thermal abatement characteristics 0 500 1000 1500 2000 2500 3000 0 25 50 75 100 125 150 pd[mw] ta[ ]
15/18 datasheet d a t a s h e e t bm2p039 tsz02201-0f1f0a200150-1-2 5.april.2016.rev.003 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 ordering model name selection b m 2 p 0 3 9 - z product name physical dimension tape and reel information dip7k making diagram dip7k bm2p039 2 1 4 3 6 7 5 part number marking lot number ? order quantity needs to be multiple of the minimum quantity. tube container quantity direction of feed 2000pcs direction of products is fixed in a container tube
16/18 datasheet d a t a s h e e t bm2p039 tsz02201-0f1f0a200150-1-2 5.april.2016.rev.003 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and s upply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy b oard. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guarantee d under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequenc e and delays, especially if the ic has more than one power supply. therefore, give special consider ation to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assemb ly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
17/18 datasheet d a t a s h e e t bm2p039 tsz02201-0f1f0a200150-1-2 5.april.2016.rev.003 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 operational notes ? continued 11. unused input pins input pins of an ic are of ten connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unc onnected, the electric field from th e outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adjac ent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (a nd thus to the p substrate) should be avoided. figure 19. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that th e output voltage, output current, and power di ssipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ic?s power dissipation rating. if however th e rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. the ic should be powered down and turned on again to resume normal oper ation because the tsd circui t keeps the outputs at the off state even if the tj falls below the tsd threshold. note that the tsd circuit operates in a situation that exceeds the absolute ma ximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other t han protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated over current protection circuit that is acti vated when the load is shorted. this protection circuit is effective in pr eventing damage due to sudden and unexpecte d incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit.
18/18 datasheet d a t a s h e e t bm2p039 tsz02201-0f1f0a200150-1-2 5.april.2016.rev.003 ? 2016 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 date rev. no. revision point 2015.10.14 001 new release 2016.1.20 002 p.3 minimum pulse width, standard 400ns 650ns p.10 min pulse width is fixed as 400 nsec 650 nsec 2016.4.5 003 p.1 dip7 dip7k p.2 avalanche energy addition p. 3 thermal shut down temperature max value addition p. 3 maximum value of minimum pulse width addition p.3 start current 2 specification change p.6 start time point data addition p.14 dip7 dip7k p.15 ordering model name selection p.15 dip7 dip7k
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our p roducts are designed and manufactured for application in ordinary electronic equipment s ( such as av equipment, oa equipment, telecommunication equipment, home elec tronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, f uel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales represe ntative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific appl ications. ( n ote1) m edical e quipment c lassification of the s pecific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsi bilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are designed and manufactured for use under standard conditions a nd not under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any special or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, pri or to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our prod ucts in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in p roximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cleanin g residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proo f design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of pe rformance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under devian t condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products , please consult with the roh m representative in advance. for details , please refer to rohm mounting specification
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considerin g variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in t his document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in t his document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive product, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condition (e .g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excess ive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaution for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information an d data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party reg arding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatso ever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bm2p039 package dip7 unit quantity 2000 minimum package quantity 2000 packing type tube constitution materials list inquiry rohs yes bm2p039 - web page

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